Molded interconnected devices refer to devices interconnected to or molded with circuits to perform functions other than the device primarily made for. For instance, the calling feature in the steering wheel, the function is made available by interconnecting systems of a headset and subsequent circuits being molded in the steering wheel of the car. With continuous innovation and desire for new technology, the number of patents in molded interconnect devices (MID) has seen a two fold increase since 2010.
The Global Molded Interconnect Device Market is expected to reach USD 2119.85 million by 2025, from USD 786.21 million in 2017 growing at a CAGR of 13.2% during the forecast period of 2018 to 2025. The upcoming market report contains data for historic years 2016, the base year of calculation is 2017 and the forecast period is 2018 to 2025.
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Some of the major countries covered in this report are U.S., Canada, Germany, France, U.K., Netherlands, Switzerland, Turkey, Russia, China, India, South Korea, Japan, Australia, Singapore, Saudi Arabia, South Africa and Brazil among others.
Major Market Drivers and Restraints:
- High trends of wearable devices and its penetration in the market.
- Increasing focus on reducing electronic wastes.
- Increasing usage of MID in healthcare.
- Internet of Things (IoT) and its growing demand among industries.
- High costs of raw materials and tooling.
- Extent of incompatibility with other electronic systems.
Top Key Venders:
- MacDermind Inc.,
- Molex Llc,
- TE Connectivity,
- HARTING Technology Group,
And More other Companies are Arlington Plating Company, Johnan America Inc., MID Solutions GmbH, LaserMicronics, Yomura, TactoTek Corporation, DowDuPont (The Dow Chemical Company, DuPont), Multiple Dimensions AG, Galtronics USA ltd., Teprosa GmbH, Cicor Management AG, 2E Mechatronic, RTP Company, TONGDA Group, and S2P Smart Plastic Products S2P among others.
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Segmentation of Market
- Based on the product,
- Antennae and connectivity modules,
- Connectors and switches,
- Lighting and others.
- Based on process,
- Laser direct structuring,
- Two-shot molding, others
- Based on end users,
- Consumer products,
- Military and aerospace,
- Telecommunication and computing, and others.
- Based on geography
- North America & South America,
- Middle East & Africa
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